Long-term strategic partnerships with major industry chip manufacturers.
Integration of full industry chain R&D resources for consumer electronics and automotive electronics.
Continuous micro-innovation for mature products.
Cross-disciplinary product integration capabilities.
Parallel development capabilities across multiple technical platforms.
In-depth modular technology research focused on customer value.
Comprehensive service capabilities for differentiated customized products.
Goal-oriented, standardized R&D process management.
High perceived quality.
High reliability.
Continuous micro-innovation.
Cost optimization in solutions.
AI Application Deployment
Automotive-grade high reliability.
Integration of innovative resources in the industry.
Multi-platform development and maintenance service capabilities.
Standardized and universal product design.
High-Performance Intelligent Cockpit
Leading Customer Experience with Product Intelligence
Integrated Software Development and Service Capabilities
Innovative Design and Craftsmanship
Headquarters: Hengdu Electronics Co., Ltd., No. 8 Huitai Road,
Hui’ao Avenue, Huinan High-Tech Industrial Park, Huizhou City.
R&D Center: 10th Floor, Building C3, Nanshan Zhiyuan, Xueyuan Avenue,
Xili Street, Nanshan District, Shenzhen City.
